Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2015 | Multiscale Modeling of Strength and Toughness of 3D IC Intermetallic Micro Bumps | C-H Yu; C-C Lin; C-S Chen; CHUIN-SHAN CHEN | 13th U.S. National Congress on Computational Mechanics | |||
2015 | Multiscale Modeling of Strength and Toughness of 3D IC Intermetallic Microbump | C-H Yu; C-C Lin; C-S Chen; CHUIN-SHAN CHEN | First Computational Mechanics Conference in Taiwan (ACMT 2015) |