公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2010 | The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering | Lin, Y.W.; Wang, Y.W.; C. ROBERT KAO ; CHIEN-CHENG CHANG | Journal of Alloys and Compounds | | | |
2010 | Electromigration in flip chip solder joints under extra high current density | Lin, Y.W.; Ke, J.H.; Chuang, H.Y.; Lai, Y.S.; C. ROBERT KAO | Journal of Applied Physics | 23 | 23 | |
2010 | Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to solders | Wang, Y.W.; Lin, Y.W.; C. ROBERT KAO | Journal of Alloys and Compounds | | | |
2010 | Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints | Tsai, M.Y.; Lin, Y.L.; Lin, Y.W.; Ke, J.H.; C. ROBERT KAO | Journal of electronic materials | 2 | 2 | |