第 1 到 3 筆結果,共 3 筆。
公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 | |
---|---|---|---|---|---|---|---|
1 | 2021 | Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment | Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; C. ROBERT KAO | Journal of Materials Research and Technology | |||
2 | 2021 | Grain Boundary Diffusion of Ni through Au-Doped Ni3Sn2 Intermetallic Compound for Technological Applications | Zhu Z.X; Renganathan V; C. ROBERT KAO | Journal of Electronic Materials | |||
3 | 2021 | A new spalling mechanism of intermetallics from the adhesion layer in the terminal-stage reaction between Cu and Sn | Tsai C.-H; Lin S.-Y; Lee P.-T; C. ROBERT KAO | Intermetallics |