https://scholars.lib.ntu.edu.tw/handle/123456789/148836
Title: | Electrical Analysis and Simulation for MLC Packaging | Authors: | Wu, Ruey-Beei | Issue Date: | 1993 | Start page/Pages: | 31-40 | Source: | SEMI Taiwan Technical Symposium | URI: | http://scholars.lib.ntu.edu.tw/handle/123456789/304059 |
Appears in Collections: | 電機工程學系 |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.