https://scholars.lib.ntu.edu.tw/handle/123456789/432571
Title: | Refine microstructure of solder materials via minor element additions | Authors: | Chung C.K. Yu J.J. Yang T.L. C. ROBERT KAO |
Issue Date: | 2019 | Publisher: | VDE Verlag GmbH | Source: | 13th Electronic Circuits World Convention: Connecting the World | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85073554472&partnerID=40&md5=51ca09aa458c6006105649602d8acdc5 https://scholars.lib.ntu.edu.tw/handle/123456789/432571 |
ISBN: | 9783800736065 |
Appears in Collections: | 材料科學與工程學系 |
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