https://scholars.lib.ntu.edu.tw/handle/123456789/438585
Title: | Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model | Authors: | KUO-CHI LIAO Lu H.-L. |
Issue Date: | 2015 | Journal Volume: | 137 | Journal Issue: | 3 | Source: | Journal of Electronic Packaging, Transactions of the ASME | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/438585 | ISSN: | 10437398 | DOI: | 10.1115/1.4030803 |
Appears in Collections: | 生物機電工程學系 |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.