https://scholars.lib.ntu.edu.tw/handle/123456789/632032
Title: | Additive-induced crystallization of highly (111) textured Cu nanotwins by electroless deposition | Authors: | Shih, P. S. Huang, C. H. C. ROBERT KAO |
Keywords: | Electroless plating | Nanotwinned Cu | Preferred orientation | Issue Date: | 5-Oct-2023 | Journal Volume: | 958 | Source: | Journal of Alloys and Compounds | Abstract: | High-density Cu nanotwins in columnar grains were successfully fabricated within an electroless-deposited Cu film using a formaldehyde-based electroless plating solution. Such a structure was achieved by using a standard electroless plating process without high-speed stirring. Additives within the plating bath induced the crystallization of the nanotwinned structure in the reduced Cu atoms. In addition, the deposited Cu nanotwins comprised as high as 87% of the (111) textured orientation. The characteristics of the (111)-oriented Cu nanotwins and the advantages of the electroless deposition process indicate that this method is promising for future applications in the electronics industry. |
URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/632032 | ISSN: | 09258388 | DOI: | 10.1016/j.jallcom.2023.170531 |
Appears in Collections: | 材料科學與工程學系 |
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