公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2014 | Nickel-tin solid-liquid inter-diffusion bonding | Yu, C.-C.; Su, P.-C.; Bai, S.J.; Chuang, T.-H.; TUNG-HAN CHUANG | International Journal of Precision Engineering and Manufacturing | | | |
1988 | Nontraditional grain refinement through phase transformation in an Al-Zn alloy | Chuang, T.-W.; Chen, S.-J.; TUNG-HAN CHUANG | Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers,Series A/Chung-kuo Kung Ch'eng Hsuch K'an | | | |
1982 | Observations of fracture surface chemistry on Cu-0.5 At. % Sb bicrystals | Chuang, T.H.; Gust, W.; Heldt, L.A.; Hintz, M.B.; Hofmann, S.; Lu?i?, R.; Predel, B.; TUNG-HAN CHUANG | Scripta Metallurgica | | | |
1992 | On the mechanisms of high-temperature intergranular embrittlements of Ni3Al-Zr Alloys | Chuang, T. H.; Pan, Y. C.; ChuangTH | Metallurgical and Materials Transactions A23 | | | |
1992 | On the mechanisms of high-temperature intergranular embrittlements of Ni<inf>3</inf>Al-Zr Alloys | Chuang, T.H.; Pan, Y.C.; TUNG-HAN CHUANG | Metallurgical Transactions A | | | |
2022 | Optimization of Ag-alloy ribbon bonding — An approach to reliable interconnection for high power IC packaging | CHUN-HAO CHEN; TUNG-HAN CHUANG | Microelectronics Reliability | 1 | 3 | |
2020 | An Optimized Ag-5Pd-3.5Au Bonding Wire for the Resistance of Ag Ion Migration in LED Packages | Chuang T.-H; Lee P.-I; Lin Y.-C.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
1996 | The oxidation behavior of Ni<inf>3</inf>Al-Zr alloys with various zirconium contents | Chang, T.T.; Pan, Y.C.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Alloys and Compounds | | | |
2007 | Oxidation-Induced Whisker Growth on the Surface of Sn-6.6(La, Ce) Alloy | Chuang, Tung-Han ; Lin, Hsiu-Jen; Chi, Chih-Chien | Journal of Electronic Materials | 7 | | |
2017 | p-type cuprous oxide thin films with high conductivity deposited by high power impulse magnetron sputtering | Sun, H.; Chen, S.-C.; Wen, C.-K.; Chuang, T.-H.; Arab Pour Yazdi, M.; Sanchette, F.; Billard, A.; TUNG-HAN CHUANG | Ceramics International | | | |
2020 | p-type semi-transparent conductive NiO films with high deposition rate produced by superimposed high power impulse magnetron sputtering | Chuang, T.-H.; Wen, C.-K.; Chen, S.-C.; Liao, M.-H.; Liu, F.; Sun, H.; MING-HAN LIAO ; TUNG-HAN CHUANG | Ceramics International | | 10 | |
2002 | Phase Identification And Growth Kinetics of the Intermetallic Compounds Formed during In-49Sn/Cu Soldering Reactions | Chuang, T. H.; Yu, C. L.; Chang, S. Y.; Wang, S. S.; ChuangTH | Journal of Electronic Materials | 44 | | |
2003 | Plasma-enhanced chemical-vapor deposition oxide prepared at low-flow conditions for course wavelength-division multiplexing optical-waveguide devices | Chu, A. K.; Lin, J. Y.; Wang, M. L.; Fan, C. C.; Shue, H. S.; Chuang, T. H.; Chen, S. Y.; Chiu, C. H.; Lin, S. F.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2000 | Plastic flow behavior during the forging of a 6061 AI/10 Vol Pct Al<inf>2</inf>O<inf>3</inf> (p) composite | Yeh, M.S.; Weng, W.P.; Wang, S.C.; Chuang, T.H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
1999 | Progress on superplasticity and superplastic forming in Taiwan during 1987-1997 | Huang, J.C.; Chuang, T.H.; TUNG-HAN CHUANG | Materials Chemistry and Physics | | | |
2007 | Rapid growth of tin whiskers on the surface of Sn-6.6Lu alloy | Chuang, T.H.; Lin, H.J.; Chi, C.C.; TUNG-HAN CHUANG | Scripta Materialia | | | |
2007 | Rapid growth of tin whiskers on the surface of Sn–6.6Lu alloy | Chuang, T.H.; Lin, H.J.; Chi, C.C.; ChuangTH | Scripta Materialia | | | |
2006 | Rapid whisker growth on the surface of Sn-3Ag-0.5Cu-1.0Ce solder joints | Chuang, T.-H.; TUNG-HAN CHUANG | Scripta Materialia | | | |
2006 | Rapid whisker growth on the surface of Sn–3Ag–0.5Cu–1.0Ce solder joints | Chuang, Tung-Han | Scripta Materialia | | | |
1999 | Recent research and development activities on superplasticity in Taiwan | Huang, J. C.; Chuang, T. H.; TUNG-HAN CHUANG | Towards Innovation in Superplasticity Ii | | | |