公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2017 | p-type cuprous oxide thin films with high conductivity deposited by high power impulse magnetron sputtering | Sun, H.; Chen, S.-C.; Wen, C.-K.; Chuang, T.-H.; Arab Pour Yazdi, M.; Sanchette, F.; Billard, A.; TUNG-HAN CHUANG | Ceramics International | | | |
2020 | p-type semi-transparent conductive NiO films with high deposition rate produced by superimposed high power impulse magnetron sputtering | Chuang, T.-H.; Wen, C.-K.; Chen, S.-C.; Liao, M.-H.; Liu, F.; Sun, H.; MING-HAN LIAO ; TUNG-HAN CHUANG | Ceramics International | | 10 | |
2002 | Phase Identification And Growth Kinetics of the Intermetallic Compounds Formed during In-49Sn/Cu Soldering Reactions | Chuang, T. H.; Yu, C. L.; Chang, S. Y.; Wang, S. S.; ChuangTH | Journal of Electronic Materials | 44 | | |
2003 | Plasma-enhanced chemical-vapor deposition oxide prepared at low-flow conditions for course wavelength-division multiplexing optical-waveguide devices | Chu, A. K.; Lin, J. Y.; Wang, M. L.; Fan, C. C.; Shue, H. S.; Chuang, T. H.; Chen, S. Y.; Chiu, C. H.; Lin, S. F.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2000 | Plastic flow behavior during the forging of a 6061 AI/10 Vol Pct Al<inf>2</inf>O<inf>3</inf> (p) composite | Yeh, M.S.; Weng, W.P.; Wang, S.C.; Chuang, T.H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
1999 | Progress on superplasticity and superplastic forming in Taiwan during 1987-1997 | Huang, J.C.; Chuang, T.H.; TUNG-HAN CHUANG | Materials Chemistry and Physics | | | |
2007 | Rapid growth of tin whiskers on the surface of Sn-6.6Lu alloy | Chuang, T.H.; Lin, H.J.; Chi, C.C.; TUNG-HAN CHUANG | Scripta Materialia | | | |
2007 | Rapid growth of tin whiskers on the surface of Sn–6.6Lu alloy | Chuang, T.H.; Lin, H.J.; Chi, C.C.; ChuangTH | Scripta Materialia | | | |
2006 | Rapid whisker growth on the surface of Sn-3Ag-0.5Cu-1.0Ce solder joints | Chuang, T.-H.; TUNG-HAN CHUANG | Scripta Materialia | | | |
2006 | Rapid whisker growth on the surface of Sn–3Ag–0.5Cu–1.0Ce solder joints | Chuang, Tung-Han | Scripta Materialia | | | |
1999 | Recent research and development activities on superplasticity in Taiwan | Huang, J. C.; Chuang, T. H.; TUNG-HAN CHUANG | Towards Innovation in Superplasticity Ii | | | |
2004 | Reflow and Burn-in of a Sn-20ln-0.8Cu Ball Grid Array Package with a Au/Ni/Cu Pad | Chiang, M.J.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
1998 | Relationship between wettability and interfacial reaction for Sn10Ag4Ti on Al<inf>2</inf>O<inf>3</inf> and SiC substrates | Chai, Y.H.; Weng, W.P.; Chuang, T.H.; TUNG-HAN CHUANG | Ceramics International | | | |
2012 | Reliable Microjoints Formed by Solid-Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture | Chang, Jing-Yao; Cheng, Ren-Shin; Kao, Kuo-Shu; Chang, Tao-Chih; Chuang, Tung-Han | IEEE Transactions on Components, Packaging and Manufacturing Technology | 29 | 24 | |
1997 | Role of grain size on the stress corrosion cracking of 7475 aluminum alloys | Tsai T.C; TUNG-HAN CHUANG | Materials Science and Engineering A | 133 | 99 | |
2004 | Selective formation of intermetallic compounds in Sn-20In-0.8Cu ball grid array solder joints with Au/Ni surface finishes | Wu, Hsing-Fei; Chiang, Ming-Jui; Chuang, Tung-Han | Journal of Electronic Materials | 6 | | |
2008 | Size effect of rare-earth intermetallics in Sn-9Zn-0.5Ce and Sn-3Ag-0.5Cu-0.5Ce solders on the growth of tin whiskers | Chuang, T.H.; Lin, H.J.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2002 | Soldering reactions between In49Sn and Ag thick films | Cheng, M.D.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2014 | Solid Liquid Interdiffusion Bonding of (Pb, Sn)Te Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer | Chuang, T.H.; Lin, H.J.; Chuang, C.H.; Yeh, W.T.; Hwang, J.D.; Chu, H.S.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2016 | Solid Liquid Interdiffusion Bonding of Zn<inf>4</inf>Sb<inf>3</inf> Thermoelectric Material with Cu Electrode | Lin, Y.C.; Lee, K.T.; Hwang, J.D.; Chu, H.S.; Hsu, C.C.; Chen, S.C.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |