公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2011 | The orientation relationship between Ni and Cu6Sn5 formed during the soldering reaction | Chen W.M.; Yang T.L.; Chung C.K.; C. ROBERT KAO | Scripta Materialia | 31 | 31 | |
2012 | Origin and evolution of voids in electroless Ni during soldering reaction | Chung C.K.; Chen Y.J.; Chen W.M.; C. ROBERT KAO | Acta Materialia | 32 | 32 | |
2012 | Soldering reactions under space confinement for 3D IC applications | Kao C.R.; Chuang H.Y.; Chen W.M.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; C. ROBERT KAO | Electronic Components and Technology Conference | 10 | 0 | |
2010 | Spectacular epitaxial growth of (Cu,Ni)6Sn5 formed on Ni substrate | Chen W.M.; C. ROBERT KAO | International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference | |||
2012 | Systematic investigation of Sn-Ag and Sn-Cu modified by minor alloying element of titanium | Chen W.M.; Kang S.K.; C. ROBERT KAO | Electronic Components and Technology Conference |