Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
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2015 | Time-varying wetting behavior on copper wafer treated by wet-etching | Tu, S.-H.; Wu, C.-C.; Wu, H.-C.; Cheng, S.-L.; Sheng, Y.-J.; Tsao, H.-K.; YU-JANE SHENG | Applied Surface Science | |||
2008 | Tiny bubble removal by gas flow through porous superhydrophobic surfaces: Ostwald ripening | Chang, F.-M.; Sheng, Y.-J.; Cheng, S.-L.; Tsao, H.-K.; YU-JANE SHENG | Applied Physics Letters |