Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
2012 | 3D simulation of substrate noise coupling from Through Silicon Via (TSV) and noise isolation methods | Lin, L.J.-H.; Chang, H.-P.; Wu, T.-L.; Chiou, Y.-P.; TZONG-LIN WU ; YIH-PENG CHIOU | 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2012 | | | |
2011 | 68.2: Using rigorous electromagnetic analysis in modeling OLEDs with gratings | Yeh, W.-L.; Chiou, Y.-P.; Lin, C.-L.; Chen, C.-W.; Lee, C.-C.; YIH-PENG CHIOU | SID International Symposium | | | |
2015 | A Circular-Ring Miniaturized-Element Metasurface With Many Good Features for Frequency Selective Shielding Applications | Huang, F.-C.; Chiu, C.-N.; Wu, T.-L.; Chiou, Y.-P.; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Transactions on Electromagnetic Compatibility | | 51 | |
2014 | A novel 2.5-dimensional ultraminiaturized-element frequency selective surface | Yu, Y.-M.; Chiu, C.-N.; Chiou, Y.-P.; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Transactions on Antennas and Propagation | | | |
2012 | A novel TSV model considering nonlinear MOS effect for transient analysis | Chen, K.-Y.; Sheu, Y.-A.; Cheng, C.-H.; Lin, J.-H.; Chiou, Y.-P.; TZONG-LIN WU ; YIH-PENG CHIOU | 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2012 | | | |
2019 | Compressed hierarchical schur algorithm for frequency-domain analysis of photonic structures | Du, C.-H.; Chiou, Y.-P.; Wang, W.; YIH-PENG CHIOU ; Wang, Weichung | Taiwanese Journal of Mathematics | 0 | 2 | |
2007 | Improved finite-difference frequency-domain scheme for the analysis of 2-D photonic crystals | Chiang, Y.-C.; Chiou, Y.-P.; HUNG-CHUN CHANG ; YIH-PENG CHIOU | IEEE MTT-S International Microwave Symposium | | | |
2012 | Novel crosstalk modeling for multiple through-silicon-vias (TSV) on 3-D IC: Experimental validation and application to Faraday cage design | Chang, Y.-J.; Chuang, H.-H.; Lu, Y.-C.; Chiou, Y.-P.; Wu, T.-L.; Chen, P.-S.; Wu, S.-H.; Kuo, T.-Y.; Zhan, C.-J.; Lo, W.-C.; YI-CHANG LU ; TZONG-LIN WU | 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012 | | | |
2013 | Power distribution network modeling for 3-D ICs with TSV arrays | Shen, C.-K.; Lu, Y.-C.; Chiou, Y.-P.; Cheng, T.-Y.; Wu, T.-L.; YI-CHANG LU ; TZONG-LIN WU | Asia and South Pacific Design Automation Conference, ASP-DAC | | | |
2011 | Using rigorous electromagnetic analysis in modeling OLEDs with gratings | Yeh, W.-L.; Chiou, Y.-P.; Lin, C.-L.; Chen, C.-W.; Lee, C.-C.; YIH-PENG CHIOU | 49th Annual SID Symposium, Seminar, and Exhibition | | | |