公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2002 | Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films | Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H. | Journal of Materials Engineering and Performance | | | |
2002 | Intermetallic compounds formed at the interface between liquid indium and copper substrates | Yu, C. L.; Wang, S. S.; Chuang, T. H. | Journal of Electronic Materials | | | |
2002 | Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates | Chiu, M. Y.; Wang, S. S.; Chuang, T. H. | Journal of Electronic Materials | | | |
2004 | Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu Solder Ball Grid Array Packages | Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H. | Journal of Electronic Materials | | | |
2004 | Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004) | Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | 0 | |
2003 | Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages | Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; ChuangTH | Journal of Electronic Materials | | | |
2002 | Intermetallic Compounds formed during the Soldering Reactions of Eutectic Sn-9Zn with Cu and Ni Substrates | Chan, Y. C.; Chiu, M. Y.; Chuang, T. H. | Zeitschrift fur Metallkunde 93: | | | |
2006 | Intermetallic Formation in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge Solder BGA Packages with Au/Ni/Cu Pads | Chuang, T. H.; Yen, S. F.; Cheng, M. D. | J. Electron. Mater | | | |
2006 | Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes | Chuang, T. H.; Yen, S. F.; Cheng, M. D.; ChuangTH | Journal of Electronic Materials | | | |
2003 | Joining alumina to inconel 600 and UMCo-50 superalloys using an Sn10Ag4Ti active filler metal | Chang, S. Y.; Hung, Y. T.; Chuang, T. H. | Journal of Materials Engineering and Performance | | | |
1991 | Long-term oxidation behaviour of Ni3Al alloys with and without chromium additions | Pan, Y. C.; Chuang, T. H.; Yao, Y. D. | Journal of Materials Science | | | |
1995 | Low-pressure diffusion bonding of SAE 316 stainless steel by inserting a superplastic interlayer | Yeh, M. S.; Chuang, T. H. | Scripta Metallurgica et Materialia | | | |
1990 | Magnetization study on grain-boundary precipitation in a Ni-8 at. % Sn alloy | Yao, Y. D.; Chen, Y. Y.; Li, T. J.; Chuang, T. H. | J. Appl. Phys | | | |
2006 | Mechanical properties of intermetallic compounds on lead-free solder by moir? techniques | Tsai, Iting; Wu, Enboa; Yen, S. F.; Chuang, T. H. | Journal of Electronic Materials | | | |
2004 | Mechanisms for interfacial reactions between liquid Sn-3.5Ag solders and cu substrates | Chuang, T. H.; Wu, H. M.; Cheng, M. D.; Chang, S. Y.; Yen, S. F.; ChuangTH | Journal of Electronic Materials | | | |
2004 | Mechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactions | Chuang, T. H.; Huang, K. W.; Lin, W. H.; ChuangTH | Journal of Electronic Materials | | | |
1998 | Microstructural Aspects of Serrated Yielding Behavior in the Al-Li 8090 Alloy | Chang, J. C.; Tsai, T. C.; Chuang, T. H. | Zeitschrift fur Metallkunde | | | |
2002 | Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate | Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H. | Journal of Materials Engineering and Performance | | | |
2003 | Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy | Chang, S. Y.; Wang, S. S.; Tsao, L. C.; Chuang, T. H. | Metallurgical and Materials Transactions A | | | |
1991 | The Mutual Effects of B, Zr and Al on Grain Boundary Segregation in Ni3Al Intermetallic Compounds | Chuang, T. H. | Materials Science and Engineering A141: | | | |