Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2014 | Inhibition of gold embrittlement in micro-joints for three-dimensional integrated circuits | Shih W.L.; Yang T.L.; Chuang H.Y.; Kuo M.S.; C. ROBERT KAO | Journal of Electronic Materials | |||
2010 | Oxidation behavior of ENIG and ENEPIG surface finish | Lee C.C.; Chuang H.Y.; Chung C.K.; C. ROBERT KAO | International Microsystems Packaging Assembly and Circuits Technology Conference, 2010 and International 3D IC Conference | |||
2012 | Soldering reactions under space confinement for 3D IC applications | Kao C.R.; Chuang H.Y.; Chen W.M.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; C. ROBERT KAO | Electronic Components and Technology Conference | 10 | 0 |