Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2015 | Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping | Bashir M.N.; Haseeb A.S.M.A.; Rahman A.Z.M.S.; Fazal M.A.; C. ROBERT KAO | Journal of Materials Science |