公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2009 | Design and modeling of a stopband-enhanced EBG structure using ground surface perturbation lattice for power/ground noise suppression | T.-K. Wang; C.-Y. Hsieh; H.-H. Chuang; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 40 | ||
2012 | Eye prediction of digital driver with power distribution network noise | C.-C. Chou; H.-H. Chuang; S.-H. Weng; C.-K. Cheng; TZONG-LIN WU | IEEE Elect. Performance Electronics Package Systems | |||
2013 | Novel differential-mode equalizer with broadband common-mode filtering for Gb/s differential-signal transmission | Y.-J. Cheng; H.-H. Chuang; C.-K. Cheng; TZONG-LIN WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 17 | ||
2010 | Overview of power integrity solutions on package and PCB: decoupling and EBG isolation | T.-L. Wu; H.-H. Chuang; T.-K. Wang; Wu, Tzong-Lin | IEEE Transactions on Electromagnetic Compatibility | 161 | ||
2008 | Parallel-plate noise isolation using a macro-via photonic crystal structure in advanced package | H.-H. Chuang; T.-L. Wu; T.-K. Wang; TZONG-LIN WU | Asia-Pacific Microw. Conf. | |||
2008 | Power integrity chip-package-PCB co-Simulation for I/O interface of DDR3 high-speed memory | H.-H. Chuang; S.-J. Wu; M.-Z. Hong; D. Hsu; R. Huang; TZONG-LIN WU | Elect. Design Adv. Packag. Systems Symp. | |||
2009 | Signal/power integrity design strategy for low-cost package of high-speed memory I/O interfaces | H.-H. Chuang; C.-J. Hsu; M.-Z. Hong; D. Hsu; R. Huang; L.-C. Hsiao; TZONG-LIN WU | IEEE Electron. Design Adv. Packag. Systems Symp. | |||
2011 | Suppression of common-mode radiation and mode-conversion for slot-crossing GHz differential signals using novel grounded resonators | H.-H. Chuang; TZONG-LIN WU | IEEE Transactions on Electromagnetic Compatibility | 4 |