Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
1995 | Thermal expansion anisotropy in hot-pressed SiC-whisker-reinforced alumina composites | Becher P.F.; Hsueh C.-H.; Waters S.B.; CHUN-HWAY HSUEH | Materials Science and Engineering A | |||
2019 | Thermochromic vanadium dioxide film on textured silica substrate for smart window with enhanced visible transmittance and tunable infrared radiation | Chen Y.-S.; Ho H.-C.; Lai Y.-C.; Nagao T.; Hsueh C.-H.; CHUN-HWAY HSUEH | Infrared Physics and Technology | |||
2017 | TiO2-based nanocomposites with metallic nanostructures on nanobranched substrate for photocatalytic water splitting | Ho H.-C.; Yeh M.-H.; Hwang B.-J.; Hsueh C.-H.; CHUN-HWAY HSUEH | Optics InfoBase Conference Papers | |||
2001 | Toughening and strengthening response in Ni3Al-Bonded titanium carbide cermets | Becher P.F.; Plucknett K.P.; Hsueh C.-H.; CHUN-HWAY HSUEH | Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques | |||
2003 | Viscoelastic stress relaxation in film/substrate systems - Kelvin model | Ko S.-C.; Lee S.; Hsueh C.-H.; CHUN-HWAY HSUEH | Journal of Applied Physics | |||
2017 | Viscous flow and viscosity measurement of low-temperature imprintable AuCuSi thin film metallic glasses investigated by nanoindentation creep | Wang C.; Liao Y.-C.; Chu J.P.; Hsueh C.-H.; CHUN-HWAY HSUEH | Materials and Design | |||
2015 | Zr?VTi?VNi thin film metallic glass as a diffusion barrier between copper and silicon | Wang C.-W.; Yiu P.; Chu J.P.; Shek C.-H.; Hsueh C.-H.; CHUN-HWAY HSUEH | Journal of Materials Science |