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Kao C.R.
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公開日期
標題
作者
來源出版物
scopus
WOS
全文
1995
A generalized quasi-chemical model for ordered multi-component, multi-sublattice intermetallic compounds with anti-structure defects
Chen S.-L.; Kao C.R.; Chang Y.A.; C. ROBERT KAO
Intermetallics
2018
High reliability sintered silver-indium bonding with anti-oxidation property for high temperature applications
Yang C.A.; Kao C.R.; Nishikawa H.; Lee C.C.; C. ROBERT KAO
Electronic Components and Technology Conference
2005
In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing
Lin Y.H.; Hu Y.C.; Tsai C.M.; Kao C.R.; Tu K.N.; C. ROBERT KAO
Acta Materialia
2013
Interfacial reactions and electromigration in flip-chip solder joints
Ho C.E.; Kao C.R.; Tu K.N.; C. ROBERT KAO
Advanced Flip Chip Packaging
2015
Interfacial reactions between PbTe-based thermoelectric materials and Cu and Ag bonding materials
Li C.C.; Drymiotis F.; Liao L.L.; Hung H.T.; Ke J.H.; Liu C.K.; Kao C.R.; Snyder G.J.; C. ROBERT KAO
Journal of Materials Chemistry C
2006
Journal of Electronic Materials: Foreword
Suganuma K.; Chen S.-W.; Kao C.R.; Lee H.M.; Swenson D.J.; C. ROBERT KAO
Journal of Electronic Materials
0
0
2019
Mechanical reliability assessment of Cu6Sn5 intermetallic compound and multilayer structures in Cu/Sn interconnects for 3D IC applications
Wu J.-Y.; Kao C.R.; Yang J.-M.; C. ROBERT KAO
Electronic Components and Technology Conference
1996
A mechanism for reactive diffusion between Si single crystal and NbC powder compact
Kao C.R.; Woodford J.; Chang Y.A.; C. ROBERT KAO
Journal of Materials Research
1990
Model for micelle formation in copolymer/homopolymer blends
Kao C.R.; De La Cruz M.O.; C. ROBERT KAO
The Journal of Chemical Physics
2016
Novel Self-shrinking Mask for Sub-3 nm Pattern Fabrication
Yang P.-S.; Cheng P.-H.; Kao C.R.; C. ROBERT KAO
; MIIN-JANG CHEN
Scientific Reports
9
12
1993
On the composition dependencies of self-diffusion coefficients in B2 intermetallic compounds
Kao C.R.; Chang Y.A.; C. ROBERT KAO
Intermetallics
1993
On the optimization of solution model parameter values of phases and the calculation of phase diagrams
Chen S.-L.; Zuo Y.; Kao C.R.; Chang Y.A.; C. ROBERT KAO
Calphad
1996
On the site preferences of ternary additions to triple defect B2 intermetallic compounds
Pike L.M.; Kao C.R.; Chen S.-L.; Chang Y.A.; C. ROBERT KAO
TMS Annual Meeting
2019
Organic-Inorganic Solid-State Hybridization with High-Strength and Anti-Hydrolysis Interface
Yang T.H.; Kao C.R.; Shigetou A.; C. ROBERT KAO
Scientific Reports
8
2018
Organic/inorganic interfacial microstructures achieved by fast atom beam bombardment and vacuum ultraviolet irradiation
Yang T.H.; Kao C.R.; Shigetou A.; C. ROBERT KAO
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference
2016
Pattern formation during interfacial reaction in-between liquid Sn and Cu substrates - A simulation study
Ke J.H.; Gao Y.; Kao C.R.; Wang Y.; C. ROBERT KAO
Acta Materialia
1993
Phase equilibria of the cu-in system I: Experimental investigation
Bolcavage A.; Chen S.W.; Kao C.R.; Chang Y.A.; Romig A.D.; C. ROBERT KAO
Journal of Phase Equilibria
1993
Phase equilibria of the cu-in system II: Thermodynamic assessment and calculation of phase diagram
Kao C.R.; Bolccwage A.; Chen S.-L.; Chen S.W.; Chang Y.A.; Romig A.D.; C. ROBERT KAO
Journal of Phase Equilibria
1997
Reactions of solid copper with pure liquid tin and liquid tin saturated with copper
Hayashi A.; Kao C.R.; Chang Y.A.; C. ROBERT KAO
Scripta Materialia
1996
Reactive diffusion between silicon and niobium carbide: Application to the in-situ synthesis of a silicon carbide-niobium disilicide composite
Kao C.R.; Woodford J.; Chang Y.A.; C. ROBERT KAO
TMS Annual Meeting