Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
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2017 | Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns | Huang, K.-M.; Tsukamoto, H.; Yong, Y.; Chiu, H.-L.; Nguyen, M.T.; Yonezawa, T.; Liao, Y.-C.; YING-CHIH LIAO | RSC Advances | |||
2017 | Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature | Yong, Y.; Nguyen, M.T.; Yonezawa, T.; Asano, T.; Matsubara, M.; Tsukamoto, H.; Liao, Y.-C.; Zhang, T.; Isobe, S.; Nakagawa, Y.; YING-CHIH LIAO | Journal of Materials Chemistry C |