Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2000 | Formation and resettlement of (AuxNi1-x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish | Ho C.E.; Zheng R.; Luo G.L.; Lin A.H.; C. ROBERT KAO | Journal of Electronic Materials | |||
2000 | Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate | Chen C.; Ho C.E.; Lin A.H.; Luo G.L.; C. ROBERT KAO | Journal of Electronic Materials |