公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2004 | A new electromagnetic bandgap power plane with super-broadband suppression of ground bounce noise in high speed circuits | T.-K. Wang; C.-C. Wang; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | Int. Conf. Electromagn. Application Compat. | |||
2005 | A new frequency selective surface power plane with broad band rejection for simultaneous switching noise on high-speed printed circuit boards | T.-K. Wang; C.-C. Wang; S.-T. Chen; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU | IEEE Int. Symp. Electromagn. Compat. | 10 | 0 | |
2005 | A novel embedded power plane with 10GHz stopband for simultaneous switching noise | C.-C. Wang; S.-M. Wu; C.-H. Chou; C.-W. Tsai; T.-K. Wang; Y.-H. Lin; S.-T. Chen; T.-L. Wu; TZONG-LIN WU | Electron. Compon. Technol. Conf. | 0 | ||
2008 | A novel stopband-enhanced EBG planes using an embedded slow-wave structure | C.-Y. Hsieh; H.-H. Chuang; T.-K. Wang; C.-C. Wang; H.-H. Cheng; Y.-S. Wu; C.-T. Chiu; C.-P. Hung; T.-L. Wu; TZONG-LIN WU | Elect. Performance Electron. Packag. Systems | 5 | 0 | |
2004 | A novel time-domain algorithm for synthesizing broadband macromodels of coupled interconnects | C.-C. Kuo; C.-C. Wang; S.-M. Wu; C.-P. Hung; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 2 | 2 | |
2005 | A novel time-domain method for synthesizing broadband macro-PI models of differential via | T.-L. Wu; C.-C. Wang; C.-C. Kuo; J.-S. Hsieh; TZONG-LIN WU | IEEE Microwave and Wireless Components Letters | 7 | 5 | |
2006 | A time-domain approach for extracting broadband macro-π models of differential via holes | C.-C. Wang; C.-W. Ku; C.-C. Kuo; TZONG-LIN WU | IEEE Transactions on Advanced Packaging | 8 | 7 | |
2005 | Adaptive Array Beamforming with Robust Capabilities Under Random Sensor Position Errors | JU-HONG LEE ; C.-C. Wang | IEEE Proceedings - Radar, Sonar and Navigation | 22 | 16 | |
2017 | Analysis of electrical characteristics of p-type tin monoxide thin-film transistor by gated-four probe measurement | C.-C. Wang; C.-H. Tsai; S.-M. Hsu; D.-Y. Su; F.-Y. Tsai; I-C. Cheng; I-CHUN CHENG | Optics & Photonics Taiwan, International Conference 2017 | |||
2005 | Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits | T.-L. Wu; Y.-H. Lin; T.-K. Wang; C.-C. Wang; S.-T. Chen; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 227 | 187 | |
2008 | Fewest vias design for microstrip guard trace by using overlying dielectric | Y.-S. Cheng; W.-D. Guo; G.-H.Shiue; H.-H. Cheng; C.-C. Wang; R.-B. Wu; RUEY-BEEI WU | IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging | 18 | 0 | |
2005 | High electromagnetic immunity power/ground planes using L-bridged electromagnetic bandgap (EBG) structure | H.-C. Kuo; S.-T. Chen; C.-C. Wang; S.-W. Wen; H.-C. Li; C.-C. Chien; T.-L. Wu; TZONG-LIN WU | Asia-Pacific Symp. Electromagn. Compat. | |||
2011 | Mold-based compartment shielding to mitigate the intra-system coupled noise on SiP modules | C.-Y. Hsiao; C.-H. Huang; C.-D. Wang; K.-H. Liao; C.-H. Shen; C.-C. Wang; T.-L. Wu; TZONG-LIN WU | IEEE. Int. Symp. Electromagn. Compat. | 17 | 0 | |
2008 | Placement of shorting vias for power integrity in multi-layered structures | S.-H. Hsu; Y.-S. Cheng; W.-D. Guo; H.-H. Cheng; C.-C. Wang; R.-B. Wu; RUEY-BEEI WU | IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging | 0 | 0 | |
2018 | Transparent flexible a-IGZO thin-film transistors | C.-C. Wu; C.-C. Wang; S.-M. Hsu; D.-Y. Su; F.-Y. Tsai; I-C. Cheng; I-CHUN CHENG | Optics & Photonics Taiwan, International Conference |