公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2002 | Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders | Chen W.T.; Ho C.E.; C. ROBERT KAO | Journal of Materials Research | 216 | 193 | |
2017 | Eocene granulite-facies metamorphism prior to deformation of the Mianhuadi mafic complex in the Ailao Shan-Red River shear zone, Yunnan Province, SW China | Liu P.-P.; Zhou M.-F.; Zhao G.; Chung S.-L.; Chen W.T.; Wang F.; SUN-LIN CHUNG | Journal of Asian Earth Sciences | 12 | 12 | |
2001 | Interactions between solder and metallization during long-term aging of advanced microelectronic packages | Ho C.E.; Chen W.T.; C. ROBERT KAO | Journal of Electronic Materials | |||
2001 | Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish | Liu C.M.; Ho C.E.; Chen W.T.; C. ROBERT KAO | Journal of Electronic Materials | |||
2001 | Selective interfacial reaction between Ni and eutectic BiSn lead-free solder | Tao W.H.; Chen C.; Ho C.E.; Chen W.T.; C. ROBERT KAO | Chemistry of Materials |