公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2016 | Bonding of copper pillars using electroless Ni plating | Yang S.; Hung H.T.; Chen Y.B.; C. ROBERT KAO | 2016 International Conference on Electronics Packaging | |||
2017 | Chip-to-Chip Direct Interconnections by Using Controlled Flow Electroless Ni Plating | Hung H.T.; Yang S.; Chen Y.B.; C. ROBERT KAO | Journal of Electronic Materials | |||
2016 | Low-temperature, pressureless Cu-to-Cu bonding by electroless Ni plating | Yang S.; Hung H.T.; Chen Y.B.; C. ROBERT KAO | International Microsystems, Packaging, Assembly, and Circuits Technology Conference | |||
2016 | Predicted Quantum Topological Hall Effect and Noncoplanar Antiferromagnetism in K0.5RhO2 | Zhou J.; Liang Q.-F.; Weng H.; Chen Y.B.; Yao S.-H.; Chen Y.-F.; Dong J.; Guo G.-Y. | Physical Review Letters | 41 | 43 |