公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2012 | Enhancement of Through Silicon VIA Sidewall Quality by Nanosecond Laser Pulses with Chemical Etching Process | Tang, C.W.; Tseng, S.C.; Young, H.T.; Li, K.M.; Yang, M.; Liao, H.C.; HONG-TSU YOUNG | Advanced Materials Research | |||
2012 | Innovative through-silicon-via formation approach for wafer-level packaging applications | Tang, C.W.; Young, H.T.; Li, K.M.; Tang, Chao Wei; Young, Hong Tsu; Li, Kuan Ming; HONG-TSU YOUNG ; KUAN-MING LI | Journal of Micromechanics and Microengineering |