Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2021 | 3D modeling of the ground deformation along the fault rupture and its impact on engineering structures: Insights from the 1999 Chi-Chi earthquake, Shigang District, Taiwan | Lin M.-L; Lin C.-H; Li C.-H; Liu C.-Y; Hung C.-H.; MING-LANG LIN | Engineering Geology | 7 | 6 | |
2021 | 3D sandbox and numerical modeling of coseismic surface rupture induced by oblique-slip faulting and its interaction with embedded shallow foundation | Liu C.-Y; Li C.-H; Chan P.-C; Hung C.-H; Lin M.-L.; MING-LANG LIN | Engineering Geology | 6 | 5 | |
2020 | Accelerating Variant Calling with Parallelized DeepVariant | Yang C.-H; Zeng J.-W; Liu C.-Y; SHIH-HAO HUNG | ACM International Conference Proceeding Series | 1 | 0 | |
2021 | An analysis study of formosat-7/cosmic-2 radio occultation data in the troposphere | Chen S.-Y; Liu C.-Y; Huang C.-Y; Hsu S.-C; Li H.-W; Lin P.-H; Cheng J.-P; Huang C.-Y.; PO-HSIUNG LIN | Remote Sensing | 20 | 21 | |
2020 | Diagnosis technique for Clustered Multiple Transition Delay Faults | You Y.-S; Liu C.-Y; Wu M.-T; Chen P.-W; Li J.C.-M.; CHIEN-MO LI | Proceedings - 2020 IEEE International Test Conference in Asia, ITC-Asia 2020 | 3 | 0 | |
2021 | Electron Mobility Enhancement in GeSn n-Channel MOSFETs by Tensile Strain | Chuang Y; Liu C.-Y; Luo G.-L; Li J.-Y.; JIUN-YUN LI | IEEE Electron Device Letters | 10 | 7 | |
2021 | Extremely Low-Loss Planar Transition from Hollow Dielectric Waveguide to Printed Circuit Board for Millimeter-Wave Interconnect | Liu C.-Y; Ding H.-E; Wu S.-H; Wu T.-L.; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 1 | 1 | |
2021 | High-performance GeSn Electronic Devices and spin-orbit coupling in GeSn/Ge heterostructures | Liu C.-Y; Chuang Y; Tai C.-T; Kao H.-S; Tien K.-Y; Li J.-Y.; JIUN-YUN LI | LEOS Summer Topical Meeting | 0 | 0 | |
2019 | Modeling Interprocessor Communication and Performance Scalability for Distributed Deep Learning Systems | Lyu Y.-H; Liu C.-Y; Lee C.-P; Tu C.-H; Hung S.-H.; SHIH-HAO HUNG | 2019 International Conference on High Performance Computing and Simulation, HPCS 2019 | 0 | 0 | |
2022 | Novel strategy for flexible and super-hydrophobic SERS substrate fabricated by deposited gold nanoislands on organic semiconductor nanostructures for bio-detection | Wang K.-S; Tseng Z.-L; Liu C.-Y; Kuan T.-Y; RU-JONG JENG ; Yang M.-C; Wang Y.-L; Liu T.-Y. | Surface and Coatings Technology | 5 | 5 | |
2021 | Schottky Barrier Height Modulation of Metal/n-GeSn Contacts Featuring Low Contact Resistivity by in Situ Chemical Vapor Deposition Doping and NiGeSn Alloy Formation | Chuang Y; Liu C.-Y; Kao H.-S; Tien K.-Y; Luo G.-L; Li J.-Y.; JIUN-YUN LI | ACS Applied Electronic Materials | 10 | 8 | |
2021 | Significant Crosstalk Reduction in High-Density Hollow Dielectric Waveguides by Photonic Crystal Fence | Liu C.-Y; DIng H.-E; Wu S.-H; Wu T.-L.; TZONG-LIN WU | IEEE Transactions on Microwave Theory and Techniques | 2 | 3 | |
2021 | Strain Effects on Rashba Spin-Orbit Coupling of 2D Hole Gases in GeSn/Ge Heterostructures | Tai C.-T; Chiu P.-Y; Liu C.-Y; Kao H.-S; Harris C.T; Lu T.-M; Hsieh C.-T; Chang S.-W; Li J.-Y.; JIUN-YUN LI | Advanced Materials | 6 | 7 | |
2020 | Systematic Hold-time Fault Diagnosis and Failure Debug in Production Chips | Liu C.-Y; Wu M.-T; Li J.C.-M; Bhargava G; Nigh C.; CHIEN-MO LI | Proceedings of the Asian Test Symposium | 1 | 0 | |
2020 | Think Hard or Think Smart: Network Reconfigurations After Divergent Thinking Associate With Creativity Performance | Wu H.-Y; Kuo B.-C; Huang C.-M; Tsai P.-J; Hsu A.-L; Hsu L.-M; Liu C.-Y; Chen J.-H; BO-CHENG KUO ; JYH-HORNG CHEN | Frontiers in Human Neuroscience | 1 | 1 | |
2018 | Weak anti-localization of two-dimensional holes in germanium beyond the diffusive regime | Chou C.-T; Jacobson N.T; Moussa J.E; Baczewski A.D; Chuang Y; Liu C.-Y; Li J.-Y; Lu T.M.; JIUN-YUN LI | Nanoscale | 12 | 8 |