Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2014 | A novel noise mitigation design for TSV-to-device coupling using power distribution network | C.-P. Chang; M.-K. Kang; T.-Y. Huang; K.-B. Wu; RUEY-BEEI WU | IEEE 23rd Topical Meeting on Electrical Performance of Electronic Packaging and Systems | |||
2014 | Artificial neural network modeling for extrinsic capacitance of FinFET | W.-C. Chen; C.-P. Chang; M.-K. Kang; T.-Y. Huang; K.-B. Wu; RUEY-BEEI WU | IEEE 23rd Topical Meeting on Electrical Performance of Electronic Packaging and Systems |