公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2012 | A linear 4- element model of VRM - characteristics, practical uses and limitations | E. H.-K. Hsiung; Y.-L. Li; R.-B. Wu; T. Su; Y.-S. Cheng; K.-B. Wu; RUEY-BEEI WU | IEEE Electrical Design for Advanced Packaging and Systems Symposium | 6 | 0 | |
2009 | A wide-band microstrip-to- microstrip multi-layered via transition using LTCC technology | C.-C. Tsai; Y.-S. Cheng; T.-Y. Huang; R.-B. Wu; RUEY-BEEI WU | 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009 | 6 | 0 | |
2011 | Design of microstrip-to-microstrip via transition in multi-layered LTCC for frequencies up to 67GHz | C.-C. Tsai; Y.-S. Cheng; T.-Y. Huang; A. Y. P. Hsu; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging and Manufacturing Technology | 51 | 40 | |
2011 | Direct eye diagram optimization for arbitrary transmission lines using FIR filter | Y.-S. Cheng; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Components, Packaging, and Manufacturing Technology | 16 | 15 | |
2014 | Efficient multi-node optimal placement for decoupling capacitors on PCB | S.-Y. Huang; Y.-S. Cheng; C.-Y. Huang; B. Liu; S. Chang; D. Chiang; P. Gu; R.-B. Wu; RUEY-BEEI WU | IEEE 18th Workshop on Signal and Power Integrity (SPI) | 7 | 0 | |
2012 | Enhanced eye-height estimation of mismatched lossy transmission lines | S.-Y. Huang; Y.-S. Cheng; B. Liu; R.-B. Wu; RUEY-BEEI WU | IEEE 21st Topical Meeting on Electrical Performance of Electronic Packaging and Systems | 2 | 0 | |
2010 | Enhanced microstrip guard trace for ringing noise suppression using a dielectric superstrate | Y.-S. Cheng; W.-D. Guo; C.-P. Hung; RUEY-BEEI WU ; D. De Zutter | IEEE Transactions on Advanced Packaging | 26 | 16 | |
2008 | Fewest vias design for microstrip guard trace by using overlying dielectric | Y.-S. Cheng; W.-D. Guo; G.-H.Shiue; H.-H. Cheng; C.-C. Wang; R.-B. Wu; RUEY-BEEI WU | IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging | 18 | 0 | |
2010 | Optimization of FIR filter to improve eye diagram for general transmission line systems | Y.-S. Cheng; Y.-C. Lai; R.-B. Wu; RUEY-BEEI WU | Design, Automation, and Test in Europe Conference | 6 | 0 | |
2011 | Passive FIR filter design using reflections from stubs for high speed links | Y.-S. Cheng; R.-B. Wu; RUEY-BEEI WU | 2011 Electrical Design of Advanced Packaging and Systems | 0 | 0 | |
2008 | Placement of shorting vias for power integrity in multi-layered structures | S.-H. Hsu; Y.-S. Cheng; W.-D. Guo; H.-H. Cheng; C.-C. Wang; R.-B. Wu; RUEY-BEEI WU | IEEE 17th Topical Meeting on Electrical Performance of Electronic Packaging | 0 | 0 | |
2011 | SI-aware layout and equalizer design to enhance performance of high-speed links in blade servers | Y.-S. Cheng; H.-H. Lu; M. Chang; S. Chang; B. Liu; R.-B. Wu; RUEY-BEEI WU | IEEE 20th Topical Meeting on Electrical Performance of Electronic Packaging | 5 | 0 | |
2013 | SI-aware vias and contact pads layouts and L-R equalization technique for 12Gb/s backplane serial I/O interconnections | Y.-S. Cheng; B. Liu; R.-B. Wu; RUEY-BEEI WU | IEEE Transactions on Electromagnetic Compatibility | 5 | 3 |