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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Eliminating Voids at Al <sub>2</sub> O <sub>3</sub> -Cu Interface During Direct Bonding
Details
Eliminating Voids at Al <sub>2</sub> O <sub>3</sub> -Cu Interface During Direct Bonding
Journal
International Journal of Applied Ceramic Technology
Journal Volume
12
Journal Issue
5
Pages
1020-1026
Date Issued
2015
Author(s)
Lee, Shao-Kuan
Tuan, Wei-Hsing
WEI-HSING TUAN
DOI
10.1111/ijac.12314
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/492258
URL
http://doi.wiley.com/10.1111/ijac.12314
Type
journal article