Publication: Implementation of silicon-on-glass MEMS devices with embedded through-wafer silicon vias using the glass reflow process for wafer-level packaging and 3D chip integration
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Date
2008
Authors
Lin, Chiung-Wen
Lin, Chiung-Wen;Hsu, Chia-Pao;Yang, Hsueh-An;Wang, Wei Chung;Fang, Weileun
Hsu, Chia-Pao
Yang, Hsueh-An
Wang, Wei Chung
WEICHUNG WANG