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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Interfacial reactions of cu and in for low-temperature processes
Details
Interfacial reactions of cu and in for low-temperature processes
Journal
2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019
Pages
435-439
Date Issued
2019
Author(s)
Wang, Y.-W.
C. ROBERT KAO
DOI
10.1109/EPTC47984.2019.9026712
URI
https://www.scopus.com/inward/record.url?eid=2-s2.0-85082992918&partnerID=40&md5=9d5ed02a18b911c70722bed18a004cba
https://scholars.lib.ntu.edu.tw/handle/123456789/546627
Type
conference paper
