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  4. Low-defect-density WS2 by hydroxide vapor phase deposition
 
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Low-defect-density WS2 by hydroxide vapor phase deposition

Journal
Nature communications
Journal Volume
13
Journal Issue
1
Date Issued
2022-07-18
Author(s)
Wan, Yi
Li, En
Yu, Zhihao
Huang, Jing-Kai
Li, Ming-Yang
Chou, Ang-Sheng
Lee, Yi-Te
Lee, Chien-Ju
Hsu, Hung-Chang
Zhan, Qin
Aljarb, Areej
Fu, Jui-Han
Chiu, Shao-Pin
Wang, Xinran
Lin, Juhn-Jong
YA-PING CHIU  
Chang, Wen-Hao
Wang, Han
Shi, Yumeng
Lin, Nian
Cheng, Yingchun
Tung, Vincent
Li, Lain-Jong
DOI
10.1038/s41467-022-31886-0
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/633926
URL
https://api.elsevier.com/content/abstract/scopus_id/85134416966
Abstract
Two-dimensional (2D) semiconducting monolayers such as transition metal dichalcogenides (TMDs) are promising channel materials to extend Moore's Law in advanced electronics. Synthetic TMD layers from chemical vapor deposition (CVD) are scalable for fabrication but notorious for their high defect densities. Therefore, innovative endeavors on growth reaction to enhance their quality are urgently needed. Here, we report that the hydroxide W species, an extremely pure vapor phase metal precursor form, is very efficient for sulfurization, leading to about one order of magnitude lower defect density compared to those from conventional CVD methods. The field-effect transistor (FET) devices based on the proposed growth reach a peak electron mobility ~200 cm2/Vs (~800 cm2/Vs) at room temperature (15 K), comparable to those from exfoliated flakes. The FET device with a channel length of 100 nm displays a high on-state current of ~400 µA/µm, encouraging the industrialization of 2D materials.
Type
journal article

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