https://scholars.lib.ntu.edu.tw/handle/123456789/304385
Title: | 3D Thermal-ADI: An Efficient Chip-Level Transient Thermal Simulator | Authors: | Ting-Yuan Wang Yu-Min Lee CHUNG-PING CHEN |
Issue Date: | Apr-2003 | Source: | ACM International Symposium on Physical Design (ISPD) | URI: | http://scholars.lib.ntu.edu.tw/handle/123456789/304385 |
Appears in Collections: | 電子工程學研究所 |
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