https://scholars.lib.ntu.edu.tw/handle/123456789/404559
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | M. H.Liao | en_US |
dc.contributor.author | G.-H. Liu | en_US |
dc.contributor.author | M.-Y. Yu | en_US |
dc.contributor.author | C.-H. Chen | en_US |
dc.contributor.author | C.-X. Hong | en_US |
dc.creator | C.-X. Hong;C.-H. Chen;M.-Y. Yu;G.-H. Liu;M. H.Liao | - |
dc.date.accessioned | 2019-03-11T08:02:17Z | - |
dc.date.available | 2019-03-11T08:02:17Z | - |
dc.date.issued | 2013 | - |
dc.identifier.issn | 2158-3226 | - |
dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/404559 | - |
dc.relation.ispartof | AIP Advances | en_US |
dc.title | The demonstration of nonlinear analytic model for the strain field induced by thermal copper filled TSVs (through silicon via) | en_US |
dc.type | journal article | en |
dc.identifier.doi | 10.1063/1.4819467 | - |
dc.identifier.scopus | 2-s2.0-84883875907 | - |
item.fulltext | no fulltext | - |
item.grantfulltext | none | - |
dc.relation.journalvolume | 3 | - |
dc.relation.journalissue | 8 | - |
item.openairecristype | http://purl.org/coar/resource_type/c_6501 | - |
item.openairetype | journal article | - |
item.grantfulltext | none | - |
item.cerifentitytype | Publications | - |
item.fulltext | no fulltext | - |
crisitem.author.orcid | 0000-0003-2942-4520 | - |
顯示於: | 電機工程學系 |
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