https://scholars.lib.ntu.edu.tw/handle/123456789/405635
Title: | Redistribution layer routing for wafer-level integrated fan-out package-on-packages | Authors: | Lin, T.-C. Chi, C.-C. Chang, Y.-W. |
Issue Date: | 2017 | Journal Volume: | 2017-November | Start page/Pages: | 561-568 | Source: | IEEE/ACM International Conference on Computer-Aided Design | URI: | https://www.scopus.com/inward/record.uri?eid=2-s2.0-85043492941&doi=10.1109%2fICCAD.2017.8203827&partnerID=40&md5=e54a990224ae35643ed42633a5fcc40c https://scholars.lib.ntu.edu.tw/handle/123456789/405635 |
DOI: | 10.1109/ICCAD.2017.8203827 |
Appears in Collections: | 電子工程學研究所 |
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