Au-Sn bonding material for the assembly of power integrated circuit module

Journal

Journal of Alloys and Compounds

Journal Volume

671

Pages

340-345

Date Issued

2016

Author(s)

Zhu Z.X.

Li C.C.

Liao L.L.

Liu C.K.

DOI

10.1016/j.jallcom.2016.02.065

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84959296179&doi=10.1016%2fj.jallcom.2016.02.065&partnerID=40&md5=af868a0df4fb52a676774e522c452aa6

https://scholars.lib.ntu.edu.tw/handle/123456789/432598

Publisher

Elsevier Ltd

Type

journal article