https://scholars.lib.ntu.edu.tw/handle/123456789/497568
Title: | Performance comparison of flip-chip-assembled 5-GHz 0.18-μm CMOS power amplifiers on different packaging substrates | Authors: | Kuo, C.-C. Hsu, Y.-W. Huang, W.-C. Wang, H. HSIN-CHIA LU HUEI WANG |
Issue Date: | 2013 | Journal Volume: | 3 | Journal Issue: | 12 | Start page/Pages: | 2014-2021 | Source: | IEEE Transactions on Components, Packaging and Manufacturing Technology | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/497568 | DOI: | 10.1109/TCPMT.2013.2282295 |
Appears in Collections: | 電機工程學系 |
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