https://scholars.lib.ntu.edu.tw/handle/123456789/497943
Title: | FF-bond: Multi-bit flip-flop bonding at placement | Authors: | Tsai, C.-C. Shi, Y. Luo, G. HUI-RU JIANG |
Issue Date: | 2013 | Start page/Pages: | 147-153 | Source: | Proceedings of the International Symposium on Physical Design | URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/497943 | DOI: | 10.1145/2451916.2451955 |
Appears in Collections: | 電機工程學系 |
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