https://scholars.lib.ntu.edu.tw/handle/123456789/634350
Title: | First Demonstration of Monolithic 3D Self-aligned GeSi Channel and Common Gate Complementary FETs by CVD Epitaxy Using Multiple P/N Junction Isolation | Authors: | Tu, Chien Te Liu, Yi Chun Huang, Bo Wei Chen, Yu Rui Hsieh, Wan Hsuan Tsai, Chung En Chueh, Shee Jier Cheng, Chun Yi Ma, Yichen CHEE-WEE LIU |
Issue Date: | 1-Jan-2022 | Journal Volume: | 2022-December | Source: | Technical Digest - International Electron Devices Meeting, IEDM | Abstract: | Monolithic 3D self-aligned vertically stacked Ge0.75 Si0.25 nanosheet complementary FETs with multiple P/N junction isolation by in-situ doped CVD epitaxy are experimentally demonstrated. The triple P/N junctions using Ge:B/Ge:P multilayers suppress the leakage current without extra dielectric layers. Both the top pFETs and bottom nFETs have the same uniform GeSi nanosheets thanks to the co-optimization of CVD epitaxy and highly selective HNO3 wet etching (selectivity140). Self-aligned GeSi channels and common gate architecture are fabricated as a CMOS inverter with good voltage transfer characteristics. The post-metallization annealing with the low thermal budget of 400°C improves the inverter characteristics such as switching threshold voltage and voltage gain. The self-aligned 3D stacked GeSi nanosheet pFETs on GeSi nanosheet nFETs without wafer bonding, dielectric isolation, and selective epi regrowth can simplify the process for 3D transistor stacking. |
URI: | https://scholars.lib.ntu.edu.tw/handle/123456789/634350 | ISBN: | 9781665489591 | ISSN: | 01631918 | DOI: | 10.1109/IEDM45625.2022.10019532 |
Appears in Collections: | 電機工程學系 |
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