Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
2020 | Diurnal variation of the convective area and eye size associated with the rapid intensification of tropical cyclones | LEE, J.-D.; WU, C.-C.; CHUN-CHIEH WU | Monthly Weather Review | 13 | 12 | |
2020 | Diurnal Variation of the Convective Area and Eye Size Associated with the Rapid Intensification of Tropical Cyclones | Lee, J.-D.; CHUN-CHIEH WU ; K. Ito | Mon. Wea. Rev. | | | |
2014 | Durability to Electromigration of an Annealing-Twinned Ag-4Pd Alloy Wire Under Current Stressing | Chuang, T.-H.; Lin, H.-J.; Chuang, C.-H.; Tsai, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2019 | Effect of alloying Au on the microstructural, mechanical and electrical properties of Ag-based alloy wires | Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Lee, J.-D.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG | Journal of Materials Science: Materials in Electronics | | | |
2013 | Effect of annealing twins on electromigration in Ag-8Au-3Pd bonding wires | Chuang, T.-H.; Wang, H.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2012 | Effects of annealing twins on the grain growth and mechanical properties of Ag-8Au-3Pd bonding wires | Chuang, T.-H.; Tsai, C.-H.; Wang, H.-C.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2013 | Formation and growth of intermetallics in an annealing-twinned Ag-8Au-3Pd wire bonding package during reliability tests | Chuang, T.-H.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
2013 | High performance Ag-Pd alloy wires for high frequency IC packages | Tsai, H.-H.; Chuang, T.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Lin, H.-J.; Chang, C.-C.; TUNG-HAN CHUANG | Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT | | | |
2012 | An innovative annealing-twinned Ag-Au-Pd bonding wire for IC and LED packaging | Tsai, H.-H.; Lee, J.-D.; Tsai, C.-H.; Wang, H.-C.; Chang, C.-C.; Chuang, T.-H.; TUNG-HAN CHUANG | Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT | | | |
2016 | Materials Characteristics of Ag-Alloy Wires and Their Applications in Advanced Packages | Tsai, C.-H.; Chuang, C.-H.; Tsai, H.-H.; Lee, J.-D.; Chang, D.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
2019 | New naphthyridine-based bipolar host materials for thermally activated delayed fluorescent organic light-emitting diodes | Yeh, T.-C.; Lee, J.-D.; Chen, L.-Y.; Chatterjee, T.; Hung, W.-Y.; Wong, K.-T. | Organic Electronics: physics, materials, applications | 5 | 5 | |
2018 | Resting heart rate variability in young women is a predictor of EEG reactions to linguistic ambiguity in sentences | Liou, M.; Hsieh, J.-F.; Evans, J.; I-WEN SU ; Nayak, S.; Lee, J.-D.; Savostyanov, A.N. | Brain Research | | | |
2019 | The role of deep convective cells in extreme rapid intensification | Lee, J.-D.; CHUN-CHIEH WU | AOGS 16th Annual Meeting | | | |
2013 | Surface reconstruction of an annealing twinned Ag-8Au-3Pd alloy wire under current stressing | Chuang, T.-H.; Wang, H.-C.; Chuang, C.-H.; Lin, H.-J.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2014 | Thermal stability of grain structure and material properties in an annealing twinned Ag-4Pd alloy wire | Chuang, T.-H.; Lin, H.-J.; Chuang, C.-H.; Shiue, Y.-Y.; Shieu, F.-S.; Huang, Y.-L.; Hsu, P.-C.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Journal of Alloys and Compounds | | | |
2012 | Thermal stability of grain structure and material properties in an annealing-twinned Ag-8Au-3Pd alloy wire | Chuang, T.-H.; Wang, H.-C.; Tsai, C.-H.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Scripta Materialia | | | |