公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2009 | Effect of Sn concentration on massive spalling in high-Pb soldering reaction with Cu substrate | Tsai M.H.; Lin Y.W.; Chuang H.Y.; C. ROBERT KAO | Journal of Materials Research | |||
2008 | Effect of UBM thickness on the mean time to failure of flip-chip solder joints under electromigration | Lin Y.L.; Lai Y.S.; Lin Y.W.; C. ROBERT KAO | Journal of Electronic Materials | |||
2006 | Effects of limited Cu supply on soldering reactions between SnAgCu and Ni | Ho C.E.; Lin Y.W.; Yang S.C.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 138 | 116 | |
2009 | Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu | Wang Y.W.; Lin Y.W.; Tu C.T.; C. ROBERT KAO | Journal of Alloys and Compounds | |||
1998 | Fluorescence microsatellite analysis to study the parental origin of the supernumerary chromosome in Down's syndrome | TSANG-MING KO ; HSIAO-LIN HWA ; LI-HUI TSENG ; Lin Y.W.; Cheung Y.P. | International Journal of Gynecology and Obstetrics | 2 | 1 | |
2009 | Fundamental study of the intermixing of 95Pb-5Sn high-lead solder bumps and 37Pb-63Sn pre-solder on chip-carrier substrates | CHIEN-CHENG CHANG ; Lin Y.W.; Lai Y.S.; C. ROBERT KAO | Journal of Electronic Materials | 6 | 5 | |
2009 | Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates | Wang Y.W.; Lin Y.W.; C. ROBERT KAO | Microelectronics Reliability | |||
2008 | Pronounced electromigration of Cu in molten Sn-based solders | Huang J.R.; Tsai C.M.; Lin Y.W.; C. ROBERT KAO | Journal of Materials Research | |||
2008 | Tin whisker growth induced by high electron current density | Lin Y.W.; Lai Y.-S.; Lin Y.L.; Tu C.-T.; C. ROBERT KAO | Journal of Electronic Materials | |||
2007 | Tin whisker growth induced by high electron current density | Lin Y.W.; C. ROBERT KAO | 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference | |||
2005 | Volume effect on the soldering reaction between SnAgCu solders and Ni | Ho C.E.; Lin Y.W.; Yang S.C.; C. ROBERT KAO | International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces |