第 1 到 34 筆結果,共 34 筆。
公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 | |
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1 | 2019 | Self-assembly of reduced Au atoms for vertical interconnections in three dimensional integrated circuits | Weng I.A.; Hung H.T.; Yang S.; Kao C.R.; Chen Y.H.; C. ROBERT KAO | Scripta Materialia | |||
2 | 2019 | Mechanical reliability assessment of Cu6Sn5 intermetallic compound and multilayer structures in Cu/Sn interconnects for 3D IC applications | Wu J.-Y.; Kao C.R.; Yang J.-M.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
3 | 2019 | Organic-Inorganic Solid-State Hybridization with High-Strength and Anti-Hydrolysis Interface | Yang T.H.; Kao C.R.; Shigetou A.; C. ROBERT KAO | Scientific Reports | 8 | ||
4 | 2018 | Organic/inorganic interfacial microstructures achieved by fast atom beam bombardment and vacuum ultraviolet irradiation | Yang T.H.; Kao C.R.; Shigetou A.; C. ROBERT KAO | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference | |||
5 | 2018 | High reliability sintered silver-indium bonding with anti-oxidation property for high temperature applications | Yang C.A.; Kao C.R.; Nishikawa H.; Lee C.C.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
6 | 2017 | Fast Atom Beam- and Vacuum-Ultraviolet-Activated Sites for Low-Temperature Hybrid Integration | Yang H.-W.; Kao C.R.; Shigetou A.; C. ROBERT KAO | Langmuir | |||
7 | 2017 | Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-Silver Joint | Yang C.A.; Kao C.R.; Nishikawa H.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
8 | 2016 | Novel Self-shrinking Mask for Sub-3 nm Pattern Fabrication | Yang P.-S.; Cheng P.-H.; Kao C.R.; C. ROBERT KAO ; MIIN-JANG CHEN | Scientific Reports | 9 | 12 | |
9 | 2016 | Pattern formation during interfacial reaction in-between liquid Sn and Cu substrates - A simulation study | Ke J.H.; Gao Y.; Kao C.R.; Wang Y.; C. ROBERT KAO | Acta Materialia | |||
10 | 2015 | Development of interconnection materials for Bi2Te3 and PbTe thermoelectric module by using SLID technique | Li C.C.; Hsu S.J.; Lee C.C.; Liao L.L.; Dai M.J.; Liu C.K.; Zhu Z.X.; Yang H.W.; Ke J.H.; Kao C.R.; Snyder G.J.; C. ROBERT KAO | Electronic Components and Technology Conference | |||
11 | 2015 | Interfacial reactions between PbTe-based thermoelectric materials and Cu and Ag bonding materials | Li C.C.; Drymiotis F.; Liao L.L.; Hung H.T.; Ke J.H.; Liu C.K.; Kao C.R.; Snyder G.J.; C. ROBERT KAO | Journal of Materials Chemistry C | |||
12 | 2015 | Silver as a highly effective bonding layer for lead telluride thermoelectric modules assembled by rapid hot-pressing | Li C.C.; Drymiotis F.; Liao L.L.; Dai M.J.; Liu C.K.; Chen C.L.; Chen Y.Y.; Kao C.R.; Snyder G.J.; C. ROBERT KAO | Energy Conversion and Management | |||
13 | 2013 | Interfacial reactions and electromigration in flip-chip solder joints | Ho C.E.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Advanced Flip Chip Packaging | |||
14 | 2012 | Soldering reactions under space confinement for 3D IC applications | Kao C.R.; Chuang H.Y.; Chen W.M.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; C. ROBERT KAO | Electronic Components and Technology Conference | 10 | 0 | |
15 | 2008 | Effect of multiple reflow cycles on ball impact responses of sn-4ag-0.5cu solder joints with immersion tin substrate pad finish | Lail Y.-S.; Kao C.R.; Chang H.-C.; Lee S.-H.; Kao C.-L.; Lan W.-H.; C. ROBERT KAO | 2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference | |||
16 | 2006 | Journal of Electronic Materials: Foreword | Suganuma K.; Chen S.-W.; Kao C.R.; Lee H.M.; Swenson D.J.; C. ROBERT KAO | Journal of Electronic Materials | 0 | 0 | |
17 | 2006 | Effects of limited Cu supply on soldering reactions between SnAgCu and Ni | Ho C.E.; Lin Y.W.; Yang S.C.; Kao C.R.; C. ROBERT KAO | Journal of Electronic Materials | 138 | 116 | |
18 | 2005 | In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing | Lin Y.H.; Hu Y.C.; Tsai C.M.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Acta Materialia | |||
19 | 2005 | Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton | Wu A.T.; Tamura N.; Lloyd J.R.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Materials Research Society Symposium | |||
20 | 2003 | Electromigration failure in flip chip solder joints due to rapid dissolution of copper | Hu Y.C.; Lin Y.H.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Journal of Materials Research | |||
21 | 1997 | Reactions of solid copper with pure liquid tin and liquid tin saturated with copper | Hayashi A.; Kao C.R.; Chang Y.A.; C. ROBERT KAO | Scripta Materialia | |||
22 | 1996 | Reactive diffusion between silicon and niobium carbide: Application to the in-situ synthesis of a silicon carbide-niobium disilicide composite | Kao C.R.; Woodford J.; Chang Y.A.; C. ROBERT KAO | TMS Annual Meeting | |||
23 | 1996 | On the site preferences of ternary additions to triple defect B2 intermetallic compounds | Pike L.M.; Kao C.R.; Chen S.-L.; Chang Y.A.; C. ROBERT KAO | TMS Annual Meeting | |||
24 | 1996 | A mechanism for reactive diffusion between Si single crystal and NbC powder compact | Kao C.R.; Woodford J.; Chang Y.A.; C. ROBERT KAO | Journal of Materials Research | |||
25 | 1995 | A generalized quasi-chemical model for ordered multi-component, multi-sublattice intermetallic compounds with anti-structure defects | Chen S.-L.; Kao C.R.; Chang Y.A.; C. ROBERT KAO | Intermetallics | |||
26 | 1995 | Synthesis of in situ composites through solid-state reactions: thermodynamic, mass-balance and kinetic considerations | Kao C.R.; Woodford J.; Kim S.; Zhang M.-X.; Chang Y.A.; C. ROBERT KAO | Materials Science and Engineering A | |||
27 | 1995 | Diffusional behavior in B2 intermetallic compounds | Kao C.R.; Kim S.; Chang Y.A.; C. ROBERT KAO | Materials Science and Engineering A | |||
28 | 1994 | Site preference of substitutional additions to triple-defect B2 intermetallic compounds | Kao C.R.; Pike L.M.; Chen S.-L.; Chang Y.A.; C. ROBERT KAO | Intermetallics | |||
29 | 1993 | On the composition dependencies of self-diffusion coefficients in B2 intermetallic compounds | Kao C.R.; Chang Y.A.; C. ROBERT KAO | Intermetallics | |||
30 | 1993 | A theoretical analysis for the formation of periodic layered structure in ternary diffusion couples involving a displacement type of reactions | Kao C.R.; Chang Y.A.; C. ROBERT KAO | Acta Metallurgica Et Materialia | |||
31 | 1993 | Phase equilibria of the cu-in system I: Experimental investigation | Bolcavage A.; Chen S.W.; Kao C.R.; Chang Y.A.; Romig A.D.; C. ROBERT KAO | Journal of Phase Equilibria | |||
32 | 1993 | On the optimization of solution model parameter values of phases and the calculation of phase diagrams | Chen S.-L.; Zuo Y.; Kao C.R.; Chang Y.A.; C. ROBERT KAO | Calphad | |||
33 | 1993 | Phase equilibria of the cu-in system II: Thermodynamic assessment and calculation of phase diagram | Kao C.R.; Bolccwage A.; Chen S.-L.; Chen S.W.; Chang Y.A.; Romig A.D.; C. ROBERT KAO | Journal of Phase Equilibria | |||
34 | 1990 | Model for micelle formation in copolymer/homopolymer blends | Kao C.R.; De La Cruz M.O.; C. ROBERT KAO | The Journal of Chemical Physics |