公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2006 | Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball grid array package | Chuang, Tung-Han ; Yen, Shiu-Fang | Journal of Electronic Materials | | | |
2006 | Abnormal growth of tin whiskers in a Sn<inf>3</inf>Ag0.5Cu0.5Ce solder ball grid array package | Chuang, T.-H.; Yen, S.-F.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2003 | Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler | Chang, S.Y.; Tsao, L.C.; Chiang, M.J.; Tung, C.N.; Pan, G.H.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | | | |
2008 | Active soldering of ZnS-SiO<inf>2</inf> sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal | Chang, S.Y.; Chuang, T.H.; Tsao, L.C.; Yang, C.L.; Yang, Z.S.; TUNG-HAN CHUANG | Journal of Materials Processing Technology | | | |
2001 | AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint | Chuang, T. H.; Huang, Y. T.; Tsao, L. C.; ChuangTH | Journal of Electronic Materials | | | |
2001 | AgIn<inf>2</inf>/Ag<inf>2</inf>In transformations in an In-49Sn/Ag soldered joint under thermal aging | Chuang, T.H.; Huang, Y.T.; Tsao, L.C.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
1999 | Applicability of ultrasonic testing for the determination of volume fraction of particulates in alumina-reinforced aluminum matrix composites | Fang, C.-K.; Fang, R.L.; Weng, W.P.; Chuang, T.H.; TUNG-HAN CHUANG | Materials Characterization | | | |
2015 | Applications of Ag-Alloy stud bump for IC and LED packages | Tsai, H.-H.; Tsai, C.-H.; Lee, J.-D.; Chang, D.; Shih, Y.-T.; Chen, C.-H.; Chuang, T.-H.; TUNG-HAN CHUANG | 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings | | | |
1996 | Atmospheric stress corrosion cracking of a superplastic 7475 aluminum alloy | Tsai, T.C.; Chuang, T.H.; TUNG-HAN CHUANG | Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science | | | |
2021 | Atomic Migration of Cu in Ti/Ni/Cu/Ag Backside Metallization on Si Substrate | Lee, Pei Ing; Wu, Po Ching; TUNG-HAN CHUANG | Proceedings of the World Congress on Mechanical, Chemical, and Material Engineering | 0 | 0 | |
2022 | Atomic Migration of Cu on the Surface of Si/Ti/Ni/Cu/Ag Thin Films | Lee P.-I; Wu P.-C; TUNG-HAN CHUANG | Journal of Electronic Materials | 2 | 0 | |
2019 | Atomic replacement effects on the band structure of doped perovskite thin films | Cheng, S. L.; Du, C. H.; Chuang, T. H.; TUNG-HAN CHUANG | Scientific Reports | 5 | 5 | |
2019 | Au-induced improvements in the grain stability and mechanical properties of Ag-based alloy wires under electrical current stressing | Kuo, B.-H.; Tsai, D.-C.; Huang, Y.-L.; Hsu, P.-C.; Chuang, T.-H.; Lee, J.-D.; Tsai, H.-H.; Shieu, F.-S.; TUNG-HAN CHUANG | Journal of Materials Science: Materials in Electronics | | | |
2020 | Bondability of Pd and Au Containing Ag-Alloy Wires on Au Pads for LED Package | Yuan, J.-H.; Chuang, T.-H.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | | 7 | |
2002 | Brazeability of a 3003 aluminum alloy with Al-Si-Cu-based filler metals | Tsao, L.C.; Weng, W.P.; Cheng, M.D.; Tsao, C.W.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | | | |
2001 | Brazeability of the 6061-T6 aluminum alloy with Al-Si-20Cu-based filler metals | Tsao, L.C.; Tsai, T.C.; Wu, C.S.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Materials Engineering and Performance | | | |
1997 | Brazing of aluminum matrix composite with Sn <inf>10</inf> Ag <inf>4</inf> Ti active filler metal | Weng, W.P.; Chuang, T.H.; TUNG-HAN CHUANG | Materials and Manufacturing Processes | | | |
2000 | Brazing of zirconia with AgCuTi and SnAgTi active filler metals | Chuang, T. H.; Yeh, M. S.; Chai, Y. H.; ChuangTH | Metallurgical and Materials Transactions A | 58 | | |
2017 | Characterization and crystallization kinetics of sputtered NiSi thin films for blue laser optical recording application | Ou, S.-L.; Chen, S.-C.; Lin, Y.-C.; Lin, P.-C.; Wen, C.-K.; Chuang, T.-H.; TUNG-HAN CHUANG | Vacuum | | | |
2000 | Characterization of alumina ceramics by ultrasonic testing | Chang, L.-S.; Chuang, T.-H.; TUNG-HAN CHUANG ; WEN-CHENG J. WEI | Materials Characterization | 45 | 41 | |