Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
2015 | High-speed spindle fault diagnosis with the empirical mode decomposition and multiscale entropy method | Hsieh, N.-K.; Lin, W.-Y.; Young, H.-T.; HONG-TSU YOUNG | Entropy | | | |
2016 | Highly sensitive non-enzymatic electrochemical glucose biosensor using a photolithography fabricated micro/nano hybrid structured electrode | Hsu, C.-W.; Su, F.-C.; Peng, P.-Y.; Young, H.-T.; Liao, S.; Wang, G.-J.; HONG-TSU YOUNG | Sensors and Actuators, B: Chemical | | | |
2016 | The Image Quality Effect of Optical Path in Laser Processing System with Dynamic Focus Module | Ding, C.F.; Young, H.T.; HONG-TSU YOUNG | the 5th International Conference on Nanomanufacturing (nanoMan 2016) | | | |
2015 | Improvement of Silicon Substrate Strength by an Application of Semiconductor Metallization Process | Chen, Y.J.; Tang, C.W; Young, H.T.; Gou M.H.; HONG-TSU YOUNG | International Manufacturing Conference in China (IMCC 2015) | | | |
2013 | Improving the dielectric breakdown field of silicon light-emitting-diode sub-mount by a hybrid nanosecond laser drilling strategy | Tang, C.-W.; Li, K.-M.; Yang, M.; Liao, H.-C.; Young, H.-T.; HONG-TSU YOUNG ; KUAN-MING LI | Microelectronics Reliability | | | |
2012 | Improving the sidewall quality of nanosecond laser-drilled deep through-silicon vias by incorporating a wet chemical etching process | Tang, C.-W.; Li, K.-M.; Young, H.-T.; HONG-TSU YOUNG ; KUAN-MING LI | Micro and Nano Letters | | | |
2012 | Improving the sidewall quality of nanosecond laser-drilled deep through-silicon vias by incorporating a wet chemical etching process | Chao-Wei Tang; Kuan-Ming Li; Hong-Tsu Young; HONG-TSU YOUNG | Micro & Nano Letters | | | |
2023 | An innovative integrated approach to automatic defect detection system of cell phone case manufacturing in an empirical implementation | Liao, Chao Chang; Hsu, Chih Ching; HONG-TSU YOUNG ; KUAN-MING LI | Journal of Intelligent Manufacturing | 0 | 0 | |
2012 | Innovative through-silicon-via formation
approach for wafer-level packaging
applications | Chao-Wei Tang; Hong-Tsu Young; Kuan-Ming Li; HONG-TSU YOUNG | J. Micromech. Microeng. | | | |
2012 | Innovative through-silicon-via formation approach for wafer-level packaging applications | Tang, C.W.; Young, H.T.; Li, K.M.; Tang, Chao Wei; Young, Hong Tsu; Li, Kuan Ming; HONG-TSU YOUNG ; KUAN-MING LI | Journal of Micromechanics and Microengineering | | | |
2003 | An Integrated Machining Approach for a Centrifugal Impeller | Young, H.-T.; Young, H.T.; Chuang, L.-C.; Chung, E.; YoungHT | International Journal of Advanced Manufacturing Technology | | | |
2003 | Integrated machining of a centrifugal impeller | Young, H.-T.; Chuang, L.-C.; HONG-TSU YOUNG | Transactions of the North American Manufacturing Research Institution of SME | | | |
2007 | Integrated rough machining methodology for centrifugal impeller manufacturing | Chuang, L.-C.; Young, H.-T.; Chung, E.; HONG-TSU YOUNG | International Journal of Advanced Manufacturing Technology | | | |
2019 | An investigation of alliance portfolio diversity impact on firm performance | Hung, C.-C.; Yu, S.-E.; Cheng, N.-C.; Wang, C.-H.; Chiang, W.-H.; Young, H.-T.; HONG-TSU YOUNG | Lecture Notes of the Institute for Computer Sciences, Social-Informatics and Telecommunications Engineering | | | |
1995 | Investigation of edge effect from the chip-back temperature using IR thermographic techniques | HONG-TSU YOUNG | Journal of Materials Processing Tech. | 9 | 7 | |
2015 | Investigation of optimum assembly tolerance for a machine tool spindle | Hsieh, N.-K.; Young, H.-T.; HONG-TSU YOUNG | Key Engineering Materials | 0 | 0 | |
2015 | Investigation of silicon-based light emitting diode sub-mounts: Enhanced performance and potential for improved reliability | HONG-TSU YOUNG ; KUAN-MING LI | Materials Science in Semiconductor Processing | 3 | 3 | |
1993 | IR Thermographic Techniques Applied to Tool/Chip Interface Temperature Distribution in Metal Cutting | Young, Hong-Tsu ; Chang, W.; 楊宏智 | US/Taiwan Symposium on Advanced Manufacturing Processes | | | |
2022 | Laser surface modification on rGO/ZnO composite materials for NO2 gas sensing | Lin, Che Shu; Hsieh, Hsin Fang; CHIEN-FANG DING ; KUAN-MING LI ; HONG-TSU YOUNG ; Hsiao, Wen Tse | Materials Chemistry and Physics | 5 | 5 | |
2020 | Laser-induced backward transfer of conducting aluminum doped zinc oxide to glass for single-step rapid patterning | Ding, C.-F.; Li, L.; HONG-TSU YOUNG ; CHIEN-FANG DING | Journal of Materials Processing Technology | 4 | 4 | |