公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
1996 | Technical Note: Relationship between Electrical Conductivity and Stress Corrosion Cracking Susceptibility of Al 7075 and Al 7475 Alloys | Tsai, T.C.; Chuang, T.H.; TUNG-HAN CHUANG | Corrosion (Houston) | | | |
2007 | Temperature Effects on the Whiskers in Rare-Earth Doped Sn-3Ag-0.5Cu-0.5Ce Solder Joints | Chuang, Tung-Han | Metallurgical and Materials Transactions A | 24 | | |
2014 | Thermal stability of grain structure and material properties in an annealing twinned Ag-4Pd alloy wire | Chuang, T.-H.; Lin, H.-J.; Chuang, C.-H.; Shiue, Y.-Y.; Shieu, F.-S.; Huang, Y.-L.; Hsu, P.-C.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Journal of Alloys and Compounds | | | |
2012 | Thermal stability of grain structure and material properties in an annealing-twinned Ag-8Au-3Pd alloy wire | Chuang, T.-H.; Wang, H.-C.; Tsai, C.-H.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG | Scripta Materialia | | | |
2021 | Thermal stability of grain structure for Ag nanotwinned films sputtered with substrate bias | Lai Y.-C; Wu P.-C; Chuang T.-H.; TUNG-HAN CHUANG | Materialia | | | |
2003 | Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al<inf>2</inf>O<inf>3</inf> with Sn interlayers | Liang, M.W.; Hsieh, T.E.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG | Journal of Electronic Materials | | | |
2020 | Ultrasonic Bonding of Ag and Ag-Alloy Ribbon - An Innovative Alternative for High Power IC Packages | Chen, C.-H.; Lin, Y.-C.; Groth, A.; Lai, Y.-C.; Lin, C.-Y.; Chang, H.-M.; Chuang, T.-H.; TUNG-HAN CHUANG | IEEE Transactions on Components, Packaging and Manufacturing Technology | | | |
2023 | Ultrasonic Bonding of Ag Ribbon on Si Wafers With Various Backside Metallization | Chiang, Meng Ting; Lee, Pei Ing; Lin, Ang Ying; TUNG-HAN CHUANG | International Journal of Manufacturing, Materials, and Mechanical Engineering | 0 | | |
1997 | Ultrasonic testing of artificial defects in alumina ceramic | Chang, Li-Shin; Chuang, Tung-Han | Ceramics International | | | |
2004 | 不同鋅含量鋁鋅合金腐蝕行為研究 | 張世穎; 陳富謀; 莊東漢 | 防蝕工程 | | | |
2005 | 不同鍍層基板無鉛銲錫球格陣列構裝接點之預處理與冷熱循環試驗 | 莊東漢 | | | | |
1992 | 以超音波量測陶瓷材料孔隙比之初步研究 | 吳政忠 ; 柴駿甫; 莊東漢 ; Chuang, Tung-Han | 中華民國第八屆非破壞檢測研討會論文集 | | | |
2008 | 傳統難硬銲鋁合金之真空硬銲低熔點填料金屬開發 | 莊東漢 | | | | |
1993 | 台灣地區大氣伽凡尼腐蝕試驗 | 莊東漢 | | | | |
1996 | 台灣地區建材耐久性暨標準化研討會論文集 | 莊東漢 | 台灣地區建材耐久性暨標準化研討會, 1996 | | | |
2008 | 含稀土銲錫合金表面錫鬚成長機制研究 (新制多年期第1年) | 莊東漢 | | | | |
2000 | 固液擴散接合法製作電子構裝耐溫微接點研究(Ⅲ)─子計畫一:固液擴散接合耐溫微接點界面反應研究(Ⅲ) | 莊東漢 | | | | |
2000 | 固液擴散接合法製作電子構裝耐溫微接點研究(Ⅲ)─總計畫 | 莊東漢 | | | | |
1999 | 固液擴散接合法製作電子構裝耐溫微接點研究(第二年)─子計畫一:固液擴散接合耐溫微接點界面反應研究(2/3) | 莊東漢 | | | | |
1999 | 固液擴散接合法製作電子構裝耐溫微接點研究(第二年)─總計畫 | 莊東漢 | | | | |