Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2002 | New failure mode induced by electric current in flip chip solder joint | Lin Y.H.; Hu Y.C.; Tsai J.; C. ROBERT KAO | 4th International Symposium on Electronic Materials and Packaging 2002 | |||
2003 | A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni | Tsai J.Y.; Hu Y.C.; Tsai C.M.; C. ROBERT KAO | Journal of Electronic Materials |