Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
2007 | Massive Spalling of Intermetallic in Solder-Substrate Reactions due to limited Supply of the Active Element | Yang, S. C.; Ho, C. E.; Chang, C. W.; Kao, C. R. | Journal of Applied Physics 101: | | | |
1996 | A mechanism for reactive diffusion between silicon single crystal and NbC powder compact | Kao, C. R.; Woodford, J.; Chang, and Y. A. | Journal of Materials Research | | | |
1997 | Microstructures developed in solid-liquid reactions: using Cu-Sn reaction, Ni-Bi reaction, and Cu-In reaction as examples | Kao, C. R. | Materials Science & Engineering | | | |
1993 | On the optimization of solution model parameter values of phases and the calculation of phase diagrams,” CALPHAD: Computer Coupling of Phase Diagrams and Thermochemistry | Chen, S. L.; Zuo, Y.; Kao, C. R.; Chang, Y. A. | CALPHAD: Computer Coupling of Phase Diagrams and Thermochemistry | | | |
1996 | On the relationships between the self-diffusion parameters and the thermodynamic properties in B2 intermetallic compounds | Kao, C. R. | Chinese Journal of Physics | | | |
1995 | On the site preference of ternary additions to triple defect B2 intermetallic compounds | Pike, L. M.; Kao, C. R.; Chen, S.-L.; Chang, Y. A. | | | | |
1993 | Phase equilibria of the Cu-In system I: experimental investigation | Bolcavage, A.; Chen, S. W.; Kao, C. R.; Chang, Y. A.; Romig, Jr A. D. | Journal of Phase Equilibria | | | |
1993 | Phase equilibria of the Cu-In system II: thermodynamic assessment and calculation of phase diagram | Kao, C. R.; Bolcavage, A.; Chen, S.-L.; Chen, S. W.; Chang, Y. A.; Romig, and A. D.; Jr | Journal of Phase Equilibria | | | |
2008 | Pronounced electromigration of Cu in molten Sn-based solders | Huang, J. R.; Tsai, C. M.; Lin, Y. W.; Kao, C. R. | Journal of Materials Research | | | |
1997 | Reactions of solid copper with pure liquid tin and liquid tin saturated with copper | Hayashi, A.; Kao, C. R.; Chang, Y. A. | Scripta Materialia | | | |
1995 | Reactive diffusion between Si and NbC at 1300 oC | Kao, C. R.; Woodford, J.; Chang, and Y. A. | Acta Metallurgica Sinica | | | |
1995 | Reactive diffusion between silicon niobium carbide: application to the in-situ synthesis of a silicon carbide-niobium disilicide composite | Kao, C. R.; Woodford, J.; Chang, Y. A. | | | | |
2003 | Recent progress in phase diagram calculation and application | Kao, C. R. | JOM | | | |
1999 | Schottky enhancement of contacts to n-GaAs via the exchange mechanism using NiAlxGa1-x as a metallization | Chen, C. P.; Lin, C. F.; Swenson, D.; Kao, C. R.; Jan, C. H.; Chang, Y. A.; C. ROBERT KAO | Journal of Vacuum Science & Technology B | | 2 | |
1994 | Site preference of substitutional additions in triple-defect B2 intermetallic compounds | Kao, C. R.; Pike, L. M.; Chen, S.-L.; Chang, and Y. A. | Intermetallics | | | |
2003 | Special issue on lead-free solders and processing issues in microelectronic packaging - Foreword | Lucas, J. P.; Chada, S.; Kang, S. K.; Kao, C. R.; Lin, K. L.; Ready, J.; Yu, J.; C. ROBERT KAO | Journal of Electronic Materials | | 1 | |
2004 | SPECIAL ISSUE ON PHASE STABILITY, PHASE TRANSFORMATIONS, AND REACTIVE PHASE FORMATION IN ELECTRONIC MATERIALS III | Kao, C. R.; Chen, S. W.; Lee, H. M.; Mohney, S. E.; Notis, M. R.; Swenson, D. | Journal of Electronic Materials | | | |
2004 | Special issue on Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials III - Foreword | Kao, C. R.; Chen, S. W.; Lee, H. M.; Mohney, S. E.; Notis, M. R.; Swenson, D. J.; C. ROBERT KAO | Journal of Electronic Materials | | 0 | |
2006 | Special issue papers: Phase stability, phase transformations, and reactive phase formation in electronics materials IV - Foreword | Chen, S. W.; Kao, C. R.; Lee, H. M.; Mohney, S.; Suganuma, K.; Swenson, D. J.; Chada, S.; C. ROBERT KAO | Journal of Electronic Materials | | 1 | |
1995 | Synthesis of in-situ composites through solid-state reactions: thermodynamic, mass-balance, and kinetic considerations | Kao, C. R.; Woodford, J.; Kim, S.; Zhang, M.-X.; Chang, and Y. A. | Materials Science and Engineering,A195(1-2) | | | |