Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2016 | Pattern formation during interfacial reaction in-between liquid Sn and Cu substrates - A simulation study | Ke J.H.; Gao Y.; Kao C.R.; Wang Y.; C. ROBERT KAO | Acta Materialia | |||
2014 | Phase field microelasticity model of dislocation climb: Methodology and applications | Ke J.H.; Boyne A.; Wang Y.; C. ROBERT KAO | Acta Materialia | |||
2013 | Serrated cathode dissolution under high current density: Morphology and root cause | Yang T.L.; Ke J.H.; Shih W.L.; Lai Y.S.; C. ROBERT KAO | Journal of Applied Physics | 6 | 6 |