公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
2009 | 3510-V 390-mΩ · cm2 4H-SiC lateral JFET on a semi-insulating substrate | Huang, C.-F.; Kan, C.-L.; Wu, T.-L.; Lee, M.-G.; Liu, Y.-Z.; Lee, K.-Y.; Zhao, F.; KUNG-YEN LEE | IEEE Electron Device Letters | | | |
2012 | 3D simulation of substrate noise coupling from Through Silicon Via (TSV) and noise isolation methods | Lin, L.J.-H.; Chang, H.-P.; Wu, T.-L.; Chiou, Y.-P.; TZONG-LIN WU ; YIH-PENG CHIOU | 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2012 | | | |
2015 | A Circular-Ring Miniaturized-Element Metasurface With Many Good Features for Frequency Selective Shielding Applications | Huang, F.-C.; Chiu, C.-N.; Wu, T.-L.; Chiou, Y.-P.; TZONG-LIN WU ; YIH-PENG CHIOU | IEEE Transactions on Electromagnetic Compatibility | | 51 | |
2013 | Active magnetic field canceling system | Sun, W.-L.; Chuang, F.-C.; Song, Y.-L.; Yu, C.; Ma, T.-G.; Wu, T.-L.; Chang, L.-M.; TZONG-LIN WU | EMC COMPO 2013 Proceedings - 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits | | | |
2011 | Analysis and design of GHz power noise isolation using 45 rotated photonic crystal fence | Ciccomancini Scogna, A.; Orlandi, A.; Wu, T.-L.; Wang, T.-K.; TZONG-LIN WU | IEEE International Symposium on Electromagnetic Compatibility | | | |
2013 | Behavior of oblong and rectangular bridge columns with conventional tie and multi-spiral transverse reinforcement under combined axial and flexural loads | Wu, T.-L.; Ou, Y.-C.; Yen-Liang Yin, S.; Wang, J.-C.; Wang, P.-H.; Ngo, S.-H.; Yu-Chen Ou | Journal of the Chinese Institute of Engineers, Transactions of the Chinese Institute of Engineers, Series A | | | |
2008 | Chip-package-board co-design - A DDR3 system design example from circuit designers' perspective | Lin, Y.-H.; Chou, J.; Lu, Y.-C.; Wu, T.-L.; YI-CHANG LU ; HSIN-SHU CHEN ; TZONG-LIN WU | 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 | 9 | 0 | |
2017 | The competitions of electromagnetic for undergraduate students in Taiwan: Taiwan creative electromagnetic implementation competition T-CEIC | Tsai, Z.-M.; Wu, R.-B.; Wu, T.-L.; Chen, S.-Y.; Mao, S.-G.; SHAU-GANG MAO ; SHIH-YUAN CHEN | 2017 IEEE International Conference on Computational Electromagnetics, ICCEM 2017 | 0 | 0 | |
2017 | Effective energy-saving device of Eco-Ship by using wave propulsion | Huang, S.-W.; Wu, T.-L.; Hsu, Y.-T.; Guo, J.-H.; Tsai, J.-F.; FORNG-CHEN CHIU ; JEN-HWA GUO ; JING-FA TSAI | Techno-Ocean 2016: Return to the Oceans | 7 | 0 | |
2019 | Enhanced power and signal integrity through layout optimization of high-speed memory systems | Weng, P.-Y.; Cheng, C.-H.; Wu, T.-L.; Chen, C.-H.; Chen, J.; Kuo, E.; Liao, C.-L.; Mutnury, B.; TZONG-LIN WU | IEEE Electrical Design of Advanced Packaging and Systems Symposium | | | |
1992 | Equivalent circuit of a through via in multi-layer environment | Chang, K.K.; Kuo, C.-N.; Wu, T.-L.; Chen, W.-L.; Wu, R.-B.; TZONG-LIN WU | Electrical Performance of Electronic Packaging, EPEP 1992 | | | |
2018 | Factors affecting near-end crosstalk (NEXT) in high speed serial links | Weng, P.-Y.; Chen, C.-H.; Chen, C.-H.; Liao, C.-L.; Wu, T.-L.; Mutnury, B.; TZONG-LIN WU | 15th International Conference on Electromagnetic Interference and Compatibility, INCEMIC 2018 | | | |
2009 | High voltage lateral 4H-SiC JFETs on a semi-insulating substrate | Huang, C.-F.; Kan, C.-L.; Wu, T.-L.; Lee, M.-C.; Liu, Y.-Z.; Lee, K.-Y.; Zhao, F.; KUNG-YEN LEE | Device Research Conference | | | |
2019 | Improvement of Power and Signal Integrity through Layer Assignment in High-Speed Memory Systems | Weng, P.-Y.; Cheng, C.-H.; Wu, T.-L.; Chen, C.; Chen, J.; Kuo, E.; Liao, C.-L.; Mutnury, B.; TZONG-LIN WU | 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019 | | | |
2015 | Investigation of signal integrity issues in multi-path electrostatic discharge protection device | Huang, Y.-C.; Wu, T.-L.; Chen, C.-H.; TZONG-LIN WU | 2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity, EMCSI 2015 | | | |
2018 | Modularized prototype of 5G mmWave base station system at 38 GHz | Yen, L.-H.; Huang, Y.-C.; Su, S.-H.; Fan, C.-Y.; Chu, F.-H.; Kuo, F.-Y.; Lu, H.-C.; Mao, S.-G.; Lin, K.-Y.; Yen, T.-C.; Wu, T.-L.; SHAU-GANG MAO | 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018 | | | |
2012 | Novel crosstalk modeling for multiple through-silicon-vias (TSV) on 3-D IC: Experimental validation and application to Faraday cage design | Chang, Y.-J.; Chuang, H.-H.; Lu, Y.-C.; Chiou, Y.-P.; Wu, T.-L.; Chen, P.-S.; Wu, S.-H.; Kuo, T.-Y.; Zhan, C.-J.; Lo, W.-C.; YI-CHANG LU ; TZONG-LIN WU | 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012 | | | |
2005 | A novel ultraflattened dispersion photonic crystal fiber | Wu, T.-L.; Chao, C.-H.; TZONG-LIN WU | IEEE Photonics Technology Letters | | | |
2013 | Power distribution network modeling for 3-D ICs with TSV arrays | Shen, C.-K.; Lu, Y.-C.; Chiou, Y.-P.; Cheng, T.-Y.; Wu, T.-L.; YI-CHANG LU ; TZONG-LIN WU | Asia and South Pacific Design Automation Conference, ASP-DAC | | | |
2016 | Promoting Effective Education in Electromagnetics: Taiwan's School of Accessible and Visualized Electromagnetics Formed [Education Corner] | Liao, W.-J.; Wu, R.-B.; Wu, T.-L.; Ma, T.-G.; Pang, Y.-H.; Tsai, Z.-M.; Yu, H.-H.; Tu, K.-M.; Lin, H.-C.; TZONG-LIN WU ; RUEY-BEEI WU | IEEE Antennas and Propagation Magazine | 5 | 4 | |