Issue Date | Title | Author(s) | Source | scopus | WOS | Fulltext/Archive link |
---|---|---|---|---|---|---|
2019 | Refine microstructure of solder materials via minor element additions | Chung C.K.; Yu J.J.; Yang T.L.; C. ROBERT KAO | 13th Electronic Circuits World Convention: Connecting the World | |||
2012 | Soldering reactions under space confinement for 3D IC applications | Kao C.R.; Chuang H.Y.; Chen W.M.; Yang T.L.; Kuo M.S.; Chen Y.J.; Yu J.J.; C. ROBERT KAO | Electronic Components and Technology Conference | 10 | 0 |