公開日期 | 標題 | 作者 | 來源出版物 | scopus | WOS | 全文 |
---|---|---|---|---|---|---|
2005 | In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing | Lin Y.H.; Hu Y.C.; Tsai C.M.; Kao C.R.; Tu K.N.; C. ROBERT KAO | Acta Materialia | |||
2002 | New failure mode induced by electric current in flip chip solder joint | Lin Y.H.; Hu Y.C.; Tsai J.; C. ROBERT KAO | 4th International Symposium on Electronic Materials and Packaging 2002 | |||
2003 | A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni | Tsai J.Y.; Hu Y.C.; Tsai C.M.; C. ROBERT KAO | Journal of Electronic Materials |